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Abbreviation : DLPC
Long Form : deoxidized low-phosphorous copper
No. Year Title Co-occurring Abbreviation
2018 Evolution of Nanostructure Through Thickness of Deoxidized Low-Phosphorous Copper by Three-Layer Stack Accumulative Roll-Bonding. ---
2016 Microstructural Evolution of a Nanostructured Complex Copper Alloy Processed by Accumulative Roll-Bonding of Oxygen Free Copper and DLP. ARB, EBSD, OFC
2014 Microstructure and mechanical properties of ultrafine grained complex copper alloy fabricated by accumulative roll-bonding process. ARB, OFC
2011 Development of nano-grains in deoxidized low-phosphorous copper by accumulative roll-bonding process. ARB
2011 Fabrication of nanostructured deoxidized low-phosphorous copper processed by three-layer stack accumulative roll-bonding. ARB